OPC Foundation Membership – Application Signature Request

You are receiving this email because {{email}} in your organization has begun the process for membership with the OPC Foundation.  {{email}} has indicated that you have signature authority for the application and has requested your electronic approval.

If you have questions regarding this request, please contact the initiator before proceeding.

By electronically signing the application for membership on behalf of your organization, you affirm that, if accepted for membership, the applicant will abide by the OPC Foundation Bylaws and the OPC Foundation Intellectual Property (IP) Policy.

NON-DISCLOSURE AND INTELLECTUAL PROPERTY RIGHTS

Members of the OPC Foundation agree and acknowledge that:
a. The OPC Foundation shall own all right, title and interest (including,
without limitation, all trade secrets, copyrights and other rights of property,
whether personnel or intellectual) in all works, information, ideas,
publications, reports or output, in any form, arising out of the work and/or
proceedings of any committee;

b. No proprietary information of a member of any third party shall be
disclosed to the OPC Foundation or any committee thereof, without
the appropriate consent of its owner; and

c. No work, proceedings or output in any form of any OPC Foundation
committee shall be used by any member or disclosed to any third party
or any other member, prior to the public disclosure of such work,
proceedings or output by such committee.

If you are authorized to approve this request, you may do so by electronically signing the application. Please enter your name and date, then use the left mouse button function to draw your signature in the box provided.  Alternatively, you may upload an image of your signature (GIF, PNG and JPG files up to 2 MB accepted).

Please click here to electronically sign the application.

If the above link does not work, please copy and paste the link below into your browser’s address bar and press enter:

{{url}}

If you experience difficulties with the application signing process or have questions, please reply to this email for help.